《微電子制造技術(shù)系列叢書：電子組裝技術(shù)專業(yè)英語》按照生產(chǎn)企業(yè)電子組裝工藝流程介紹了組裝元器件、印制電路板、助焊劑、膠黏劑、焊料、清洗劑等材料的基本知識，介紹了電子組裝生產(chǎn)線的組成、貼片機的基本結(jié)構(gòu)和作用。簡要介紹了焊接技術(shù)、清洗技術(shù)、檢測技術(shù)等電子組裝各工藝環(huán)節(jié)的工藝方法，生產(chǎn)過程中的靜電防護技術(shù)等內(nèi)容。
本教材適合作為應(yīng)用型、技能型人才培養(yǎng)的大專院校（高職高專）應(yīng)用電子類專業(yè)教材，也可作為電子組裝專業(yè)技術(shù)培訓(xùn)用書，供從事電子組裝工程技術(shù)人員參考。
Unit One
1.1 Printed circuit assembly
1.2 Assembly techniques
1.3 SMT design and assembly
1.4 PCB assembly flows
Unit Two SMC and SMD
2.1 Surface mount device definitions
2.2 Sizes of surface mount device
2.3 SMD chip resistors
2.4 SMD ceramic capacitors
2.5 SMD Tantalum capacitors
2.6 SMD MELF
2.7 SMD transistors
2.8 Mounting of Surface Mount component
2.9 Component size comparison
Unit Three Printed circuit boards
3.1 The types of printed circuit board
3.2 PCB design
3.3 PCBs Raw Materials
3.4 Drilling and plating the holes of printed circuit boards
3.5 Creating the printed circuit pattern on the substrate
3.6 Attaching the contact fingers
Unit Four Adhesives
Unit Five Types of solder paste fluxes
5.1 Flux and its requirement
5.2 Inorganic acid fluxes
5.3 Organic acid fluxes
5.4 Rosin
5.5 No-clean fluxes
Unit Six Solder alloys and applications
6.1 Introduction
6.2 Availability and type of solders
Unit Seven Surface Mounted Technology
7.1 Component Placement Machines
7.2 Surface Mounted Technology
7.3 Component pick-up head types
Unit Eight Techniques of solder interconnection
8.1 Soldering iron method
8.2 Hot air reflow soldering method
8.3 Laser reflow soldering method
8.4 Pulse heating method
8.5 IR method
8.6 Vapor phase soldering （VPS）method
8.7 Convection reflow method（air or N2 reflow）
8.8 Combined convection IR method
8.9 Flow /wave soldering method
8.10 The temperature profile concept
8.11 Pb-free soldering process
Unit Nine Clearung
9.1 Water-soluble fluxes
9.2 No-clean fluxes
9.3 Pcb assembly cleaning
9.4 Pcb cleaning test
Unit Ten SMA inspection technique
10.1 Vision system of component placement machines
10.2 Inspection process
10.3 Visual inspection equipment
10.4 Visual inspection items
Unit Eleven Handling and ESD control
11.1Electrostatic discharge
11.2 ESD and EOS
11.3Requirements of static-free work station
附錄 A CP-6系列富士貼片機操作簡介
Al.1 Machine components and operation panel
Al.2 Starting and Stopping the Machine
附錄 B專業(yè)詞匯
References
（2）Personal items such as plastic cups， thermos bottles， purses， sweaters， and other items of clothing should not be on work benches.
（3）Care should be taken in handling of boards after mounting the e6mponents，and it may be noted that static damage may still result by improper handling of the stuffed boards.
（4）At the soldering area， the operator is required to wear wrist strap well ground-ed through a 1MW. It is better to have a common ground for the test equipment and for the static-free work stations. Even if we provide a separate grounding for static-free workstations， it is highly likely that the ground wires short each other at some point or the other along their length. Therefore， it is recommended， if in doubt9 to check the equipment grounding thoroughly instead of going-in for a separate grounding.
（5）Insulative brushes are used for flux application and cleaning. This may resultin generation of static leading to component damage. Use of cotton is recommendedwhile cleaning or for flux application.
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