|
關(guān)于我們
 書單推薦 新書推薦 |
SMT單板互連可靠性與典型失效場景 
定 價(jià)：168 元
9 7 4 8 8 7 6 1 3 2 7 1 1 讀者對象:適合于從事電子制造、可靠性、失效分析工作的工程師學(xué)習(xí)與參考。也可作為職業(yè)技術(shù)院校電子制造相關(guān)專業(yè)的教材。 
本書是作者從事電子制造40年來有關(guān)單板互連可靠性方面的經(jīng)驗(yàn)總結(jié),討論了單板常見的失效模式、典型失效場景以及如何設(shè)計(jì)與制造高可靠性產(chǎn)品的廣泛問題，并通過大量篇幅重點(diǎn)討論了焊點(diǎn)的斷裂失效現(xiàn)象及裂紋特征。 全書內(nèi)容共4個(gè)部分，第一部分為焊點(diǎn)失效機(jī)理與裂紋特征，詳細(xì)介紹焊點(diǎn)的失效模式、失效機(jī)理、裂紋特征及失效分析方法;第二部分為高可靠性產(chǎn)品的焊點(diǎn)設(shè)計(jì)，包括封裝選型、PCBA的互連結(jié)構(gòu)設(shè)計(jì)、組裝熱設(shè)計(jì)及焊點(diǎn)的壽命評估技術(shù);第三部分為環(huán)境腐蝕與三防處理，重點(diǎn)介紹腐蝕失效與錫須問題，以及與之相關(guān)的清洗和三防工藝;第四部分為高可靠性產(chǎn)品的制造，重點(diǎn)介紹組裝工藝控制要點(diǎn)與典型缺陷焊點(diǎn)。 本書可供從手電子制造、可靠性、失效分析工作的工程師學(xué)習(xí)與參考。
賈忠中中興通訊股份有限公司首席工藝專家，從事電子制造工藝研究與管理工作近40年。在中興通訊工作期間，見證并參與了中興工藝的發(fā)展歷程。歷任工藝研究部部長、副總工藝師、總工藝師、首席工藝專家。擔(dān)任廣東電子學(xué)會(huì)SMT專委會(huì)副主任委員、中國電子學(xué)會(huì)委員。對SMT、可制造性設(shè)計(jì)、失效分析、焊接可靠性等有著深入、系統(tǒng)的研究,擅長組裝不良分析、焊點(diǎn)失效分析。出版作品有:《SMT工藝質(zhì)量控制》《SMT可制造性設(shè)計(jì)》《SMT工藝不良與組裝可靠性》《SMT核心工藝解析與案例分析》等，發(fā)表論文多篇，被粉絲譽(yù)為“實(shí)戰(zhàn)專家”。
第一部分 焊點(diǎn)失效機(jī)理與裂紋特征
第 1 章 焊點(diǎn)的可靠性 ............................................................................................ 3 1.1 焊點(diǎn) ...........................................................................................................................................3 1.1.1 焊點(diǎn)的微觀組織結(jié)構(gòu)及常見失效位置 ........................................................................4 1.1.2 焊點(diǎn)的失效標(biāo)準(zhǔn) ............................................................................................................4 1.1.3 焊點(diǎn)的斷裂類型 ............................................................................................................5 1.2 導(dǎo)致焊點(diǎn)失效的載荷條件 .......................................................................................................7 1.3 焊點(diǎn)失效機(jī)理 ...........................................................................................................................7 1.3.1 溫度循環(huán)引發(fā)的焊點(diǎn)失效機(jī)理 ....................................................................................7 1.3.2 機(jī)械應(yīng)力引發(fā)的焊點(diǎn)失效機(jī)理 ..................................................................................10 1.3.3 熱沖擊引發(fā)的焊點(diǎn)失效機(jī)理 ......................................................................................12 1.3.4 蠕變引發(fā)的焊點(diǎn)失效機(jī)理 ..........................................................................................13 1.4 焊點(diǎn)的可靠性評價(jià) .................................................................................................................14 1.4.1 焊點(diǎn)的可靠性取決于 PCBA 的互連結(jié)構(gòu)設(shè)計(jì) ..........................................................14 1.4.2 焊點(diǎn)的可靠性工作 ......................................................................................................14 1.4.3 焊點(diǎn)失效原因分析流程 ..............................................................................................15 案例 1：某單板上的 BGA 使用兩年后失效 .............................................................15 第 2 章 溫度循環(huán)導(dǎo)致的焊點(diǎn)失效........................................................................... 17 2.1 疲勞失效的典型場景 .............................................................................................................17 2.1.1 整體熱膨脹失配 ..........................................................................................................17 2.1.2 局部熱膨脹失配 ..........................................................................................................18 2.1.3 內(nèi)部熱膨脹失配 ..........................................................................................................18 2.2 疲勞失效的裂紋演進(jìn)過程與特征 .........................................................................................18 2.2.1 片式元件焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................19 2.2.2 翼形引腳焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................19 2.2.3 BGA 焊點(diǎn)疲勞失效典型裂紋特征 .............................................................................20 SMT 單板互連可靠性與典型失效場景 2.2.4 QFN 焊點(diǎn)疲勞失效典型裂紋特征 .............................................................................21 2.2.5 CBGA 焊點(diǎn)疲勞失效典型裂紋特征 ..........................................................................22 2.2.6 CCGA 焊點(diǎn)疲勞失效典型裂紋特征 ..........................................................................23 2.2.7 通孔插裝焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................24 2.2.8 焊接工藝對裂紋特征的影響 ......................................................................................24 2.3 小結(jié) .........................................................................................................................................25 第 3 章 機(jī)械應(yīng)力導(dǎo)致的焊點(diǎn)失效........................................................................... 27 3.1 機(jī)械應(yīng)力失效的典型場景 .....................................................................................................27 3.1.1 沖擊 ..............................................................................................................................27 案例 2：BGA 脫落 ......................................................................................................27 3.1.2 瞬時(shí)彎曲 ......................................................................................................................29 案例 3：插件操作導(dǎo)致 BGA 焊點(diǎn)開裂 .....................................................................29 3.1.3 循環(huán)彎曲 ......................................................................................................................31 3.1.4 振動(dòng) ..............................................................................................................................31 3.2 機(jī)械應(yīng)力失效的裂紋特征 .....................................................................................................31 3.3 脆性的界面 IMC ....................................................................................................................33 3.3.1 ENIG 鍍層形成的焊點(diǎn)具有脆性 ................................................................................34 案例 4：Ni 氧化導(dǎo)致焊點(diǎn)界面脆化 ...........................................................................37 3.3.2 不連續(xù)的塊狀 IMC ......................................................................................................40 3.4 典型應(yīng)力敏感元件及應(yīng)力失效 .............................................................................................41 3.4.1 應(yīng)力敏感封裝 ..............................................................................................................41 3.4.2 片式電容 .....................................................................................................................41 3.4.3 球柵陣列封裝 ..............................................................................................................46 案例 5：ICT 測試導(dǎo)致 BGA 焊點(diǎn)開裂 ......................................................................46 案例 6：壓接導(dǎo)致 BGA 焊點(diǎn)開裂 .............................................................................48 第 4 章 焊點(diǎn)失效分析方法.................................................................................... 51 4.1 失效分析及方法 .....................................................................................................................51 4.1.1 失效分析 ......................................................................................................................51 4.1.2 失效分析思路 ..............................................................................................................51 4.1.3 失效分析基本流程與方法 ..........................................................................................51 4.1.4 焊點(diǎn)失效分析的常用方法 ..........................................................................................52 4.2 X 射線檢測 .............................................................................................................................53 4.2.1 X 射線圖像的采集原理...............................................................................................54 4.2.2 X 射線圖像的分析.......................................................................................................56 4.3 超聲掃描顯微鏡 .....................................................................................................................58 4.3.1 超聲掃描顯微鏡概述 ..................................................................................................58 4.3.2 超聲掃描顯微鏡的工作原理 ......................................................................................58 4.3.3 分析步驟 ......................................................................................................................60 4.3.4 超聲掃描顯微鏡和 X 射線的對比..............................................................................61 4.4 切片 .........................................................................................................................................62 4.4.1 切片樣品的制備 ..........................................................................................................62 4.4.2 切片分析應(yīng)用 ..............................................................................................................64 4.5 掃描電子顯微鏡 .....................................................................................................................65 4.5.1 掃描電子顯微鏡概述 ..................................................................................................65 4.5.2 掃描電子顯微鏡的工作原理 ......................................................................................66 4.5.3 SEM 的優(yōu)點(diǎn) .................................................................................................................66 4.5.4 樣品的制備 ..................................................................................................................66 4.5.5 應(yīng)用 ..............................................................................................................................67 4.6 染色滲透 .................................................................................................................................69 4.7 光學(xué)檢測 .................................................................................................................................70 4.8 傅里葉變換紅外光譜儀 .........................................................................................................71 案例 7：PCBA 白色污染物成分的分析 ....................................................................71 案例 8：材料一致性檢驗(yàn) ............................................................................................72 第 5 章 失效原因的基本判定................................................................................. 73 5.1 焊接問題與組裝問題的判定 .................................................................................................73 5.1.1 焊接合格的標(biāo)準(zhǔn) ..........................................................................................................73 5.1.2 組裝應(yīng)力引誘或?qū)е碌暮更c(diǎn)失效 ..............................................................................75 5.2 焊點(diǎn)開裂裂紋特征圖譜 .........................................................................................................77 5.2.1 典型熱 / 機(jī)疲勞斷裂焊點(diǎn)切片圖 ...............................................................................77 5.2.2 典型機(jī)械應(yīng)力導(dǎo)致的焊點(diǎn)斷裂切片圖 ......................................................................79 5.2.3 熔斷焊點(diǎn)切片圖 ..........................................................................................................80 5.2.4 枕頭效應(yīng)焊點(diǎn)內(nèi)窺鏡圖與切片圖 ..............................................................................82 5.2.5 無潤濕開焊（NWO）焊點(diǎn)內(nèi)窺鏡圖與切片圖 .........................................................83 5.2.6 冷焊點(diǎn)切片圖 ..............................................................................................................83 5.2.7 Au 鍍層引起的焊點(diǎn)開裂 .............................................................................................84 5.2.8 小結(jié) ..............................................................................................................................85 第二部分 高可靠性產(chǎn)品的焊點(diǎn)設(shè)計(jì) 第 6 章 高可靠性 PCBA 的互連結(jié)構(gòu)設(shè)計(jì) ...............................................................89 6.1 設(shè)計(jì)步驟 .................................................................................................................................89 6.2 影響焊點(diǎn)可靠性的設(shè)計(jì)因素 .................................................................................................91 6.2.1 主要設(shè)計(jì)參數(shù) ..............................................................................................................92 6.2.2 次要設(shè)計(jì)參數(shù) ..............................................................................................................93 6.3 提升熱膨脹匹配性的設(shè)計(jì) ..................................................................................................... 94 6.3.1 PCB 的類型 .................................................................................................................. 94 6.3.2 有機(jī) PCB ...................................................................................................................... 95 6.3.3 約束芯 PCB .................................................................................................................. 97 6.3.4 陶瓷 PCB ...................................................................................................................... 99 6.3.5 柔順性 PCB .................................................................................................................. 99 6.4 可靠性加固 ........................................................................................................................... 100 6.4.1 表面組裝元器件的可靠性加固 ................................................................................100 6.4.2 插件的點(diǎn)膠加固 ........................................................................................................106 6.4.3 關(guān)于可靠性加固的應(yīng)用 ............................................................................................108 6.5 增強(qiáng)抗振動(dòng) / 沖擊能力的設(shè)計(jì)——應(yīng)力槽 ........................................................................ 109 6.6 禁限設(shè)計(jì) ............................................................................................................................... 110 第 7 章 高可靠制造的組裝熱設(shè)計(jì).......................................................................... 117 7.1 熱風(fēng)再流焊接熱特性 ........................................................................................................... 117 7.2 熱設(shè)計(jì)對焊接的影響及典型設(shè)計(jì)場景 ............................................................................... 117 7.2.1 與焊盤緊連接過孔的影響 ........................................................................................ 117 7.2.2 盤中孔 /POFV 孔的影響 ........................................................................................... 118 7.2.3 表層大銅皮的影響 .................................................................................................... 119 案例 9：BGA 四角焊點(diǎn)連接有長的導(dǎo)線，在特定工藝條件下會(huì)發(fā)生 縮錫斷裂 ...................................................................................................... 119 案例 10：QFN 與大銅皮緊連的焊點(diǎn)容易發(fā)生虛焊 ............................................... 120 案例 11：熱沉焊盤熱設(shè)計(jì)不當(dāng)導(dǎo)致 QFN 傾斜和虛焊 .......................................... 120 7.2.4 屏蔽蓋的影響 ............................................................................................................122 7.2.5 高大封裝的密集布局 ................................................................................................122 7.3 熱設(shè)計(jì)總結(jié) ........................................................................................................................... 123 第 8 章 高可靠 PCBA 的封裝選型........................................................................124 8.1 封裝對焊點(diǎn)可靠性的影響 ................................................................................................... 124 8.2 封裝特性 ............................................................................................................................... 124 8.2.1 封裝可靠性 ................................................................................................................124 8.2.2 封裝的固有疲勞壽命 ................................................................................................125 8.2.3 封裝的熱變形 ............................................................................................................126 8.3 封裝的選型 ........................................................................................................................... 129 8.3.1 封裝類別的選擇 ........................................................................................................129 8.3.2 工藝性的選擇 ............................................................................................................129 8.4 不推薦的封裝應(yīng)用場景 ....................................................................................................... 129 第 9 章 陶瓷封裝應(yīng)用要領(lǐng)................................................................................... 131 9.1 陶瓷封裝的結(jié)構(gòu)與工藝特性 ............................................................................................... 131 9.2 LCCC 工藝要領(lǐng)...................................................................................................................131 9.3 CBGA 工藝要領(lǐng) ..................................................................................................................134 案例 12：邊緣點(diǎn)膠（也稱為圍堰膠）對 CBGA 可靠性的影響研究① ..............136 9.4 CCGA 工藝要領(lǐng) ..................................................................................................................137 案例 13：CBGA、CCGA 器件植球 / 植柱工藝可靠性研究① ............................138 9.5 CQFP 工藝要領(lǐng) ...................................................................................................................139 案例 14：CQFP 器件板級溫度循環(huán)可靠性的設(shè)計(jì)與仿真① ................................140 案例 15：航天大尺寸 CQFP 器件引腳斷裂失效分析① .......................................142 第 10 章 焊點(diǎn)可靠性仿真分析與試驗(yàn)評估..............................................................149 10.1 可靠性試驗(yàn) ........................................................................................................................149 10.1.1 可靠性試驗(yàn)的分類 .................................................................................................149 10.1.2 可靠性加速試驗(yàn) .....................................................................................................150 10.2 焊點(diǎn)可靠性仿真技術(shù) ........................................................................................................150 10.2.1 焊點(diǎn)可靠性仿真分析步驟 .....................................................................................151 10.2.2 焊點(diǎn)疲勞壽命模型 .................................................................................................151 10.3 溫度循環(huán)試驗(yàn) ....................................................................................................................155 10.3.1 溫度循環(huán)試驗(yàn)簡介 .................................................................................................155 10.3.2 加速系數(shù)的計(jì)算 .....................................................................................................156 10.3.3 焊點(diǎn)可靠性評估試驗(yàn)方案 .....................................................................................158 第三部分 環(huán)境腐蝕與三防處理 第 11 章 環(huán)境因素引起的失效..............................................................................163 11.1 環(huán)境引起的失效 ................................................................................................................163 11.1.1 電化學(xué)腐蝕 ..............................................................................................................163 11.1.2 化學(xué)腐蝕 ..................................................................................................................164 11.2 枝晶生長 ............................................................................................................................165 11.2.1 枝晶形貌 ..................................................................................................................165 11.2.2 枝晶生長的 3 個(gè)要素 ..............................................................................................165 11.2.3 枝晶生長的 3 個(gè)階段 ..............................................................................................166 11.2.4 影響枝晶生長的因素 ..............................................................................................167 11.2.5 枝晶生長測試 ..........................................................................................................168 案例 16：在高溫、高濕試驗(yàn)環(huán)境下出現(xiàn)絕緣電阻下降 .......................................169 案例 17：常見的枝晶生長現(xiàn)象 ...............................................................................169 11.3 CAF ....................................................................................................................................170 11.4 銀離子遷移 ........................................................................................................................171 11.5 Ag 的硫化腐蝕 ..................................................................................................................173 案例 18：片式電阻上硅膠覆蓋導(dǎo)致硫化腐蝕 .......................................................174 11.6 爬行腐蝕 ............................................................................................................................177 11.6.1 爬行腐蝕的概念 ......................................................................................................177 11.6.2 發(fā)生場景 ..................................................................................................................178 11.6.3 爬行腐蝕機(jī)理 ..........................................................................................................178 11.6.4 爬行腐蝕與枝晶、CAF 的對比 .............................................................................179 11.6.5 硫化亞銅的危害 ......................................................................................................179 11.6.6 防護(hù)措施 ..................................................................................................................179 11.6.7 關(guān)于爬行腐蝕的研究 ..............................................................................................180 11.7 實(shí)際環(huán)境下的腐蝕 ............................................................................................................180 案例 19：充電樁單板的“濕塵”腐蝕 ...................................................................180 案例 20：電源單板的“濕塵”腐蝕 .......................................................................181 案例 21：阻焊層（綠油）內(nèi) Cu 遷移 ....................................................................181 第 12 章 錫須...................................................................................................183 12.1 關(guān)于錫須 ............................................................................................................................183 12.2 錫須產(chǎn)生的原因 ................................................................................................................184 12.3 錫須產(chǎn)生的 5 種基本場景 ................................................................................................186 12.4 室溫下錫須的生長 ............................................................................................................186 12.5 溫度循環(huán)（熱沖擊）作用下錫須的生長 ........................................................................187 12.6 氧化腐蝕引起的錫須生長 ................................................................................................188 案例 22：某輕觸開關(guān)因錫須短路 ...........................................................................189 12.7 外界壓力作用下的錫須生長 ............................................................................................190 12.8 控制錫須生長的建議 ........................................................................................................191 第 13 章 清洗工藝 ............................................................................................193 13.1 清洗的作用 ........................................................................................................................193 13.2 清洗劑的選擇 ....................................................................................................................193 13.2.1 常見污物類型 .........................................................................................................193 13.2.2 清洗劑選擇的考慮因素 .........................................................................................194 13.2.3 清洗劑的種類及特點(diǎn) .............................................................................................194 13.3 清洗設(shè)備的選擇 ................................................................................................................195 13.3.1 清洗方法與工藝 .....................................................................................................195 13.3.2 清洗設(shè)備的選擇要求 .............................................................................................196 13.4 超聲清洗工藝流程與參數(shù)設(shè)置 ........................................................................................196 13.5 助焊劑的選配 ....................................................................................................................197 13.6 清洗要求與常見不良 ........................................................................................................197 13.6.1 清洗要求 .................................................................................................................197 13.6.2 常見的清洗不良現(xiàn)象 .............................................................................................198 案例 23：清洗不干凈，有明顯可見的松香殘留物 ...............................................198 案例 24：清洗劑與鍍層不兼容或漂洗不干凈，引起鍍層變色腐蝕 ...................198 案例 25：元器件損壞 ...............................................................................................199 13.7 關(guān)于人工清洗 ....................................................................................................................199 第 14 章 敷形涂覆工藝 ......................................................................................201 14.1 敷形涂覆的目的 ................................................................................................................201 14.2 敷形涂覆材料的分類與特性 ............................................................................................202 14.2.1 敷形涂覆材料的分類 .............................................................................................202 14.2.2 常用敷形涂覆材料的物理性能 .............................................................................202 14.2.3 敷形涂覆材料的性能特性 .....................................................................................203 14.2.4 敷形涂覆材料的認(rèn)證 .............................................................................................203 14.3 敷形涂覆材料的選擇 ........................................................................................................204 14.4 敷形涂覆工藝與方法 ........................................................................................................206 14.4.1 免洗工藝條件下涂覆前是否需要清洗 .................................................................206 14.4.2 涂覆工藝 .................................................................................................................208 14.4.3 常見的涂覆不良 .....................................................................................................211 14.5 PCBA 常見的環(huán)境失效模式.............................................................................................212 14.5.1 影響 PCBA 的環(huán)境因素 .........................................................................................212 14.5.2 典型的失效模式 .....................................................................................................214 第四部分 高可靠性產(chǎn)品的制造 第 15 章 潮敏元器件的應(yīng)用 ................................................................................221 15.1 概述 ....................................................................................................................................221 15.2 潮濕敏感度等級 ................................................................................................................222 15.3 潮濕敏感度等級的評定 ....................................................................................................222 15.4 干燥包裝 ............................................................................................................................224 15.5 烘干 ....................................................................................................................................227 15.6 使用 ....................................................................................................................................228 15.7 吸潮失效案例 ....................................................................................................................231 案例 26：BGA 芯片與載板之間分層 ...............................................................................231 案例 27：塑封 BGA 載板分層現(xiàn)象 ..................................................................................232 案例 28：鉭電容過爐冒錫珠 ............................................................................................232 案例 29：SIP 內(nèi)部空洞會(huì)導(dǎo)致過爐后冒錫珠 ..................................................................234 案例 30：光驅(qū)動(dòng)器件的焊接 ............................................................................................235 | 目 錄 | SMT 單板互連可靠性與典型失效場景 第 16 章 組裝工藝控制 ..................................................................................... 238 16.1 組裝工藝對可靠性的影響 ................................................................................................238 16.2 SMT 前工藝 .......................................................................................................................240 16.2.1 去金工藝 .................................................................................................................241 16.2.2 搪錫工藝 .................................................................................................................241 16.2.3 引線成形 .................................................................................................................242 16.3 SMT 工藝 ...........................................................................................................................246 16.3.1 表面組裝元器件的焊接 .........................................................................................246 案例 31：BGA 的球窩與開焊 .................................................................................246 16.3.2 焊膏印刷 .................................................................................................................247 16.3.3 鋼網(wǎng)設(shè)計(jì) .................................................................................................................252 16.3.4 再流焊接 .................................................................................................................255 16.3.5 工藝關(guān)注點(diǎn) .............................................................................................................259 16.4 SMT 后工藝 .......................................................................................................................262 16.4.1 印制電路板和模塊的分板 .....................................................................................262 16.4.2 檢測技術(shù) .................................................................................................................262 16.4.3 篩選 .........................................................................................................................262 16.4.4 加速可靠性測試 .....................................................................................................263 第 17 章 缺陷焊點(diǎn) ........................................................................................... 264 17.1 組裝缺陷焊點(diǎn)的分類 ........................................................................................................264 17.2 虛焊 ....................................................................................................................................264 17.2.1 冷焊 .........................................................................................................................264 17.2.2 無潤濕開焊 .............................................................................................................265 17.2.3 枕頭效應(yīng) .................................................................................................................266 17.2.4 焊點(diǎn)應(yīng)力開裂 .........................................................................................................267 17.3 形態(tài)缺陷 ............................................................................................................................268 17.3.1 片式元件葡萄球焊點(diǎn) .............................................................................................268 17.3.2 片式元件兩端焊點(diǎn)爬錫高度懸殊較大 .................................................................268 17.3.3 QFP 多錫 .................................................................................................................269 17.3.4 J 形引腳多錫 ...........................................................................................................269 17.3.5 插件包焊 .................................................................................................................270 17.4 熔斷焊點(diǎn) ............................................................................................................................270 17.4.1 冷撕裂（縮錫開裂） .............................................................................................270 17.4.2 熱撕裂 .....................................................................................................................271 17.5 脆性界面焊點(diǎn) ....................................................................................................................271 參考文獻(xiàn) ......................................................................................................... 273
你還可能感興趣
我要評論
|
